Analyst

3D EM Analysis
Analyst™ 3D FEM EM simulation and analysis simulator accelerates high-frequency product development from early physical design characterization through to full 3D EM verification. The advanced solver technology provides fast and accurate analysis of the 3D structures/interconnects found in today's complex high-frequency electronics.

In-situ analysis enables full characterization of 3D components in RF/microwave devices to ensure design success.

Parametric cell (PCell) support for 3D structures enables an FEM-based design flow that incorporates accurate, custom component libraries.

Automatic, adaptive 3D volumetric tetrahedron-based meshing provides high-quality shape fidelity to ensure reliable simulation results.
Features at a Glance
- EXTRACT – Schematic-driven EM extraction technology/design flow
- Layout/Drawing Editor – 2D and 3D construction and views
- FEM Solver – Proprietary, full-wave direct and interative solvers
- Meshing Technology – Automatic, adaptive 3D volumetric tetrahedron-based meshing
- Sources – Numerous excitations for ports
- Visualization – 2D- and 3D-field visualization, as well as results post-processing
- Parametric Studies – Optimization, tuning, and yield analysis
- High Performance Computing (HPC) – Multi-core configurations and asynchronous simulation
Applications
Characterize and optimize the electrical performance of RF/microwave distributed components such as spiral inductors and metal-insulator-metal (MIM) capacitors with 3D EM analysis.
MMIC/RFIC, PCB, Packaging, and Module Interconnects
Model the behavior of complex interconnects such as vias, via fencing, wire bonds, and ball-grid arrays with fast and accurate FEM full-wave simulation technology.
Simulate near- and far-field radiation patterns, surface currents, gain, bandwidth, and return loss for planar, 3D, and phased-array antennas.
Verification
Analyze entire PCB and MMIC/RFIC layouts as part of design verification and final sign-off, capturing unintended resonances and parasitic coupling that can lead to costly design failures.