Developing PCBs for Wireless Applications With EM Verification and an RF Design Flow

Presented by: Dr. John Dunn and Mr. David Vye, Cadence
Registration: Register Here (Recording)

This webinar will showcase the use of the Cadence® AWR Design Environment®, specifically AWR® AXIEM® and AWR Microwave Office® software, to enhance the design of PCB-based wireless functionality vis-à-vis interoperability with the Cadence Allegro® platform. 

Today’s PCB designers face multiple challenges incorporating RF/microwave, analog, and digital design elements together on the same PCB. To successfully integrate RF/microwave content and mixed-signal designs, PCB layout tools and RF circuit design software must exchange design data efficiently. Cadence® AWR Design Environment® software offers an RF/microwave design and analysis platform with import and export functionality to provide a pathway to and from Cadence Allegro® design tools. 

The webinar is segmented into two parts, each examining how these tools interoperate:

EM Verification

  • Portions of the existing Allegro layout will be imported into Microwave Office software 
  • Electromagnetic (EM) simulation is performed with the AXIEM® planar EM solver 
  • A 5G board example with an eight-element patch array is simulated with AXIEM 

Design/Manufacturing Flow

  • Use of AWR Microwave Office and AWR Visual System Simulator™ to create RF/microwave devices
  • Practical RF layout, stack-up management, design support automation and layout export for use in Allegro

Presenter Bio
Dr. John Dunn is an EM technologist with Cadence and spearheads the AWR training programs. Before entering the commercial electronics industry, Dr. Dunn was a professor of electrical engineering at the University of Colorado, Boulder, for 15 years. He earned his M.S. and Ph.D. degrees in applied physics from Harvard University, Cambridge, MA.

David Vye is the technical marketing director for AWR software at Cadence responsible for product messaging and positioning into the RF/microwave market. A former editor and business development manager for Microwave Journal, David has held a number of technical and marketing positions throughout the RF/microwave industry, including business development manager at ANSYS, product marketing manager at Ansoft Corporation, senior design engineer at Raytheon Research Division and Advanced Device Center, and MMIC design engineer at M/A-COM's Advanced Semiconductor Operations. He holds a BSEE from the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.