Evaluation of Package Properties for RF BJTs
Simulation technology for high-frequency and high-speed electronics enables designers to characterize parasitic effects at a wide range of frequencies and accurately predict performance to shorten development cycles. High-quality models are required and the better the model, the more likely that the functionality of the end product will correlate with simulated performance.
This application note demonstrates the extraction procedure for the passive part of a SPICE model for the package and wire bonds of a BJT up to 10 GHz and compares the model against measurements. The package was measured in different connection models on a test fixture and parts of the package were modeled with Analyst 3D EM simulator.