Finite-element method (FEM) electromagnetic (EM) analysis for 3D structures

3D EM Analysis

Analyst™ 3D FEM EM simulation and analysis simulator accelerates high-frequency product development from early physical design characterization through to full 3D EM verification. The advanced solver technology provides fast and accurate analysis of the 3D structures/interconnects found in today's complex high-frequency electronics.

The Analyst Advantage

In-situ analysis enables full characterization of 3D components in RF/microwave devices to ensure design success.



Parametric cell (PCell) support for 3D structures enables an FEM-based design flow that incorporates accurate, custom component libraries.


Automatic, adaptive 3D volumetric tetrahedron-based meshing provides high-quality shape fidelity to ensure reliable simulation results.

Features at a Glance

  • EXTRACT – Schematic-driven EM extraction technology/design flow
  • Layout/Drawing Editor – 2D and 3D construction and views
  • FEM Solver – Proprietary, full-wave direct and interative solvers
  • Meshing Technology – Automatic, adaptive 3D volumetric tetrahedron-based meshing
  • Sources – Numerous excitations for ports
  • Visualization – 2D- and 3D-field visualization, as well as results post-processing
  • Parametric Studies – Optimization, tuning, and yield analysis
  • High Performance Computing (HPC) – Multi-core configurations and asynchronous simulation 



Characterize and optimize the electrical performance of RF/microwave distributed components such as spiral inductors and metal-insulator-metal (MIM) capacitors with 3D EM analysis.

MMIC/RFIC, PCB, Packaging, and Module Interconnects

Model the behavior of complex interconnects such as vias, via fencing, wire bonds, and ball-grid arrays with fast and accurate FEM full-wave simulation technology.

Antennas and Arrays

Simulate near- and far-field radiation patterns, surface currents, gain, bandwidth, and return loss for planar, 3D, and phased-array antennas.


Analyze entire PCB and MMIC/RFIC layouts as part of design verification and final sign-off, capturing unintended resonances and parasitic coupling that can lead to costly design failures.